DS DS/EN 60749-25
DS DSEN 60749-25 2004-JAN-05 Semconductor devces - Mechancal and clmatc test methods - Part 25 Temperature cyclng
Cart
(empty)
This part of IEC 60749 provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses.