DS DS/EN 60749-35
DS DSEN 60749-35 2007-JAN-16 Semconductor devces - Mechancal and clmatc test methods - Part 35 Acoustc mcroscopy for plastc encapsulated electronc components
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This part of 60749 defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components. This standard provides a guide to the use of acoustic microscopy for detecting anomalies (delamination, cracks, mould-compound voids, etc.) reproducibly and non-destructively in plastic packages.