This part of IEC 61192 provides information and requirements that are applicable to modification, rework and repair procedures for soldered electronic assemblies. It is applicable to specific processes used to manufacture soldered electronic assemblies where components are attached to printed boards and to the relevant parts of resulting products. The standard is also applicable to activities that can form part of the work in assembling mixed technology products.
This part of IEC 61192 also contains guidance on design matters where they have relevance to rework.
NOTE Typical in-process surface-mount rework activities to which this standard applies are shown in Figure 1.