DS DS/EN 61191-3
DS DSEN 61191-3 1999-SEP-10 Prnted board assembles - Part 3 Sectonal specfcaton - Requrements for through-hole mount soldered assembles
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This standard prescribes requirements for lead and hole solder assembly. The requirements pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).