DS DS/EN 62047-9
DS DSEN 62047-9 2011-OCT-03 Semconductor devces - Mcro-electromechancal devces - Part 9 Wafer to wafer bondng strength measurement for MEMS
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This standard describes bonding strength measurement method of wafer to wafer bonding, type of bonding process such as silicon to silicon fusion bonding, silicon to glass anodic bonding, etc., and applicable structure size during MEMS processing/assembly. The applicable wafer thickness is in the range of 10 ìm to several millimeters.