DS DS/EN 62137-1-1
DS DSEN 62137-1-1 2007-SEP-07 Surface mountng technology - Envronmental and endurance test methods for surface mount solder jont - Part 1-1 Pull strength test
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The test method described in this part of IEC 62137 is applicable to gull-wing lead surface mounting components.
The method is designed to test and evaluate the endurance of the solder joint between component leads and lands on a substrate, by means of a pull type mechanical stress. This test is suitable for evaluating the effects of repeated temperature change on the strength of the solder joint between component terminals and lands on a substrate.
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