DS DS/EN 62137-3
DS DSEN 62137-3 2012-FEB-29 Electroncs assembly technology - Part 3 Selecton gudance of envronmental and endurance test methods for solder jonts
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This part of IEC 62137 describes the selection methodology of an appropriate test method for a reliability test for solder joints of various shapes and types of surface mount devices (SMD), array type devices and leaded devices, and lead insertion type devices using various types of solder material alloys.