This specification covers the general requirements for families of standard electronic power supplies for use in military aircraft systems including combat and other mission critical applications. These power supplies are coordinated under the Standard Hardware Acquisition and Reliability Program (SHARP).

Electronic power supplies whose initial application is for airborne use are classified as one of the following families. Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in improving this document should be addressed to: Commanding Officer, Naval Air Engineering Center, Systems Engineering and Standardization Department (SESD), Code 53, Lakehurst, NJ 08733-5100 by using the self-addressed Standardization Document Improvement Proposal (DD Form 1426) appearing at the end of this document or by letter.

These units are forced air cooled Weapon Replaceable Assemblies (WRA) with an envelope in accordance with MIL-E-85726.

These units are Shop Replaceable Assemblies (SRA) in the form of modules in format B, Span 2; format C; or format E.

Classes

     Class II - For primary utilization in airborne applications and where
                stringent environmental requirements are imposed. Power
                supply interface temperature, rib surfaces, at minus 55
                degrees Celsius (°C) low and 85°C high.

     Class IV - For utilization where class II power supplies may be exposed
                to nuclear radiation. Power supply interface temperature,
                rib surfaces, at minus 55°C low and 85°C high.

Formats

     Format B - The basic size (span 2) has a span of 5.74
     Span 2     inches (145.8 millimeters (mm)), a thickness of 0.290 inches
                (7.366 mm), and a total height of 1.95 inches (49.5 mm),
                including keying pins. The size may increase in thickness
                within the constraints of MIL-STD-1389. See appendix B of
                MIL-STD-1389.

     Format C - The basic size has a span of 5.88 inches (149.4 mm), a
                thickness of 0.280 inches (7.112 mm), and a total height of
                4.06 inches (103.1 mm), including keying pins. The size may
                increase in thickness within the constraints of MIL-STD-1389.
                See appendix C of MIL-STD-1389.

     Format E - The basic size has a span of 5.88 inches (149.4 mm), a
                thickness of 0.380 inches (9.652 mm), and a total height of
                6.68 inches (169.7 mm), including keying pins. The size may
                increase in thickness within the constraints of MIL-STD-1389.
                See appendix E of MIL-STD-1389.

Correlation is the method of proving, for a power supply of a specific military part numbered power supply, that all production testers shall yield test data which matches the correlation data within close tolerance and determines if the power supply meets the requirements of the power supply associated detail specification. This appendix is a mandatory part of this specification. The information contained herein is intended for compliance.

Correlation shall be performed on all production testers used to accept, qualify, or recertify APSP. Successful correlation shall be required to certify the use of a tester and its peripheral equipment (adapter, switching cards).

Correlation is accomplished by using a common medium between the production tester and the quality assurance provision of the power supply associated detail specification. This medium provides a means of comparing the results of a specific power supply having known recorded parameters with the results of the production testers. This common medium is a power supply hereinafter termed "correlation power supply".

The APSP-QAA shall be responsible for correlation and shall determine the need for correlation of production testers associated with a given power supply military part number. The APSP-QAA shall also maintain control over the correlation power supplies and only take them to the vendor's facility during the correlation attempts.

The testing facility or acquisition activity should notify the APSP-QAA in writing of a correlation requirement as soon as it becomes known.

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